ultimateimp – Samsung officially confirmed that it will build the upcoming Exynos 2600 as its first flagship chipset using the advanced 2nm GAA (Gate-All-Around) process. The company revealed this information during a recent Q&A session, according to IDC analyst Bryan Ma. Samsung plans for the new chipset to succeed the Exynos 2500 and power select models of the Galaxy S26 series, which it expects to launch next year.
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The confirmation likely came during Samsung’s Q2 2025 earnings call held on July 31. In its financial report, Samsung announced that its Foundry Business will begin mass-producing a 2nm GAA-based mobile SoC in the second half of 2025. The company also shared plans to improve factory utilisation and grow profits by expanding its customer base.
Samsung’s move to a 2nm GAA process marks a major step forward in mobile silicon design. The new process promises better power efficiency, improved thermal performance, and stronger support for on-device AI. These upgrades are key for Samsung as it aims to compete directly with Qualcomm’s next-gen Snapdragon 8 Elite Gen 2 chipset.
The Exynos 2600 will likely become Samsung’s leading SoC for its flagship smartphones. It is expected to be featured in the Galaxy S26 and Galaxy S26+ models in select markets. However, the Galaxy S26 Ultra may continue using Qualcomm’s Snapdragon chip globally, similar to past product strategies.
Performance Leaks Hint at a Powerful and Efficient Exynos 2600
Early reports suggest the Exynos 2600 will bring meaningful improvements in both CPU and NPU performance. The chipset recently appeared on Geekbench with the model number S5E9965. It scored 2,155 points in the single-core test and 7,788 in the multi-core benchmark. These numbers place it in close competition with other high-end mobile processors expected in 2026.
The SoC is built with a 10-core CPU configuration. It includes a prime core clocked at 3.55GHz, three performance cores running at 2.96GHz, and six efficiency cores operating at 2.46GHz. This balanced layout suggests a focus on delivering strong multi-threaded performance while keeping power consumption in check.
Samsung is also integrating a Heat Pass Block (HPB) into the chip’s packaging. This addition should improve thermal management and enhance sustained performance during intensive tasks. The HPB will sit alongside DRAM within the chip’s structure, which could lead to better battery life and reduced heat output.
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In terms of AI, Samsung has indicated that the Exynos 2600 will offer a notable leap in NPU capability. Enhanced support for on-device AI functions will be critical as smartphones increasingly rely on machine learning for camera, voice. And system performance enhancements.
With production ramping up and performance details beginning to surface. The Exynos 2600 is shaping up as a key milestone in Samsung’s semiconductor roadmap. As the company returns to high-end Exynos development. It aims to close the gap with Qualcomm and re-establish its presence in flagship mobile hardware. The Galaxy S26 series will likely serve as the first test for this new generation of silicon.
